| 6436735 |
Method for mounting an integrated circuit having reduced thermal stresses between a bond pad and a metallic contact |
Martin Goetz, Sammy K. Brown, George E. Avery, Tom L. Todd, Sam Beal |
2002-08-20 |
| 6400575 |
Integrated circuits packaging system and method |
Sammy K. Brown, George E. Avery, Samuel W. Beal |
2002-06-04 |
| 6337576 |
Wafer-level burn-in |
Allan Calamoneri, Martin Goetz, John J. Zasio, George E. Avery, Sammy K. Brown |
2002-01-08 |
| 6175161 |
System and method for packaging integrated circuits |
Martin Goetz, Sammy K. Brown, George E. Avery, Tom L. Todd, Sam Beal |
2001-01-16 |
| 6128201 |
Three dimensional mounting assembly for integrated circuits |
Sammy K. Brown, George E. Avery, Tom L. Todd, Sam Beal |
2000-10-03 |
| 6075711 |
System and method for routing connections of integrated circuits |
Sammy K. Brown, George E. Avery |
2000-06-13 |