Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431533 | Circuit board with constrained solder interconnect pads | Roden R. Topacio | 2019-10-01 |
| 9793199 | Circuit board with via trace connection and method of making the same | Neil McLellan, Yip Seng Low | 2017-10-17 |
| 8772083 | Solder mask with anchor structures | Roden R. Topacio, Yu-Ling Hsieh, Yip Seng Low | 2014-07-08 |
| 8445329 | Circuit board with oval micro via | Neil McLellan | 2013-05-21 |
| 8298945 | Method of manufacturing substrates having asymmetric buildup layers | Roden R. Topacio, Liane Martinez, Yip Seng Low | 2012-10-30 |
| 8294266 | Conductor bump method and apparatus | Roden R. Topacio, Neil McLellan, Yip Seng Low | 2012-10-23 |
| 7906424 | Conductor bump method and apparatus | Roden R. Topacio, Neil McLellan, Yip Seng Low | 2011-03-15 |