Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308670 | Wireless power system with communications | Parin Patel, Daniel P. Kumar | 2025-05-20 |
| 12308671 | Wireless power system with communications | Parin Patel, Daniel P. Kumar | 2025-05-20 |
| 12222794 | Management of near field communications using a low power express mode of an electronic device | Yong Wang, Gordon Y. Scott, Scott Alan Williams | 2025-02-11 |
| 11693467 | Electronic device functionality in low power mode | Langford M. Wasada, Arun Unkn, Sriram Hariharan, Robert W. Brumley, Raman S. Thiara | 2023-07-04 |
| 11469201 | Semiconductor package and method for fabricating base for semiconductor package | Tzu-Hung Lin, Wen-Sung Hsu, Ta-Jen Yu | 2022-10-11 |
| 11121590 | Wireless power system with communications | Parin Patel, Daniel P. Kumar | 2021-09-14 |
| 11086387 | Management of near field communications using a low power express mode of an electronic device | Yong Wang, Gordon Y. Scott, Scott Alan Williams | 2021-08-10 |
| 10580747 | Semiconductor package and method for fabricating base for semiconductor package | Tzu-Hung Lin, Wen-Sung Hsu, Ta-Jen Yu | 2020-03-03 |
| 10573616 | Semiconductor package and method for fabricating base for semiconductor package | Tzu-Hung Lin, Wen-Sung Hsu, Ta-Jen Yu | 2020-02-25 |
| 10573615 | Semiconductor package and method for fabricating base for semiconductor package | Tzu-Hung Lin, Wen-Sung Hsu, Ta-Jen Yu | 2020-02-25 |
| 10354974 | Structure and formation method of chip package structure | Wen-Sung Hsu, Shih-Chin Lin, Tao Cheng | 2019-07-16 |
| 10186488 | Manufacturing method of semiconductor package and manufacturing method of semiconductor device | Wen-Sung Hsu, Shih-Chin Lin, Tao Cheng | 2019-01-22 |
| 9761534 | Semiconductor package, semiconductor device using the same and manufacturing method thereof | Wen-Sung Hsu, Shih-Chin Lin, Tao Cheng | 2017-09-12 |
| 9177899 | Semiconductor package and method for fabricating base for semiconductor package | Tzu-Hung Lin, Wen-Sung Hsu, Ta-Jen Yu | 2015-11-03 |
| 9040359 | Molded interposer package and method for fabricating the same | Thomas Matthew Gregorich, Tzu-Hung Lin | 2015-05-26 |
| 8957518 | Molded interposer package and method for fabricating the same | Thomas Matthew Gregorich, Tzu-Hung Lin | 2015-02-17 |
| 8859340 | Molded interposer package and method for fabricating the same | Thomas Matthew Gregorich, Tzu-Hung Lin | 2014-10-14 |
| 7193944 | Information recording device and method of the same | — | 2007-03-20 |
| 6928038 | Circuit for protecting synchronizing patterns | Chao-Long Tsai, Szu-Shan Lo | 2005-08-09 |
| 6496126 | Digitization apparatus and method using a finite state machine in feedback loop | Jing-Hong Conan Zhan, Chi-Kwong Ho | 2002-12-17 |
| 5974088 | Digital data slicer | — | 1999-10-26 |