AY

Akito Yoshida

AT Amkor Technology: 23 patents #25 of 595Top 5%
KT Kabushiki Kaisha Toshiba: 6 patents #4,898 of 21,451Top 25%
Sumitomo Electric Industries: 5 patents #5,365 of 21,551Top 25%
AP Amkor Technology Singapore Holding Pte.: 3 patents #102 of 289Top 40%
MP Mitsubishi Power: 1 patents #176 of 508Top 35%
Overall (All Time): #85,575 of 4,157,543Top 3%
38
Patents All Time

Issued Patents All Time

Showing 25 most recent of 38 patents

Patent #TitleCo-InventorsDate
12035472 Stackable via package and method Mahmoud Dreiza, Curtis Zwenger 2024-07-09
11700692 Stackable via package and method Mahmoud Dreiza, Curtis Zwenger 2023-07-11
11236001 Hydrothermal treatment device, biomass fuel manufacturing plant, hydrothermal treatment method, and biomass fuel manufacturing method Yoichi Shimbo, Yuta Ozawa 2022-02-01
11089685 Stackable via package and method Mahmoud Dreiza, Curtis Zwenger 2021-08-10
10548221 Stackable via package and method Mahmoud Dreiza, Curtis Zwenger 2020-01-28
10257942 Stackable variable height via package and method Mahmoud Dreiza 2019-04-09
10206285 Stackable via package and method Mahmoud Dreiza, Curtis Zwenger 2019-02-12
10034372 Stackable via package and method Mahmoud Dreiza, Curtis Zwenger 2018-07-24
9730327 Stackable via package and method Mahmoud Dreiza, Curtis Zwenger 2017-08-08
9012789 Stackable via package and method Mahmoud Dreiza, Curtis Zwenger 2015-04-21
8704368 Stackable via package and method Mahmoud Dreiza, Curtis Zwenger 2014-04-22
8623753 Stackable protruding via package and method Mahmoud Dreiza, Curtis Zwenger 2014-01-07
8471154 Stackable variable height via package and method Mahmoud Dreiza 2013-06-25
8466545 Stackable semiconductor package Young Wook Heo 2013-06-18
8300423 Stackable treated via package and method Robert Francis Darveaux, Ludovico E. Bancod 2012-10-30
8227905 Stackable semiconductor package Young Wook Heo 2012-07-24
8222538 Stackable via package and method Mahmoud Dreiza, Curtis Zwenger 2012-07-17
8022521 Package failure prognostic structure and method Mahmoud Dreiza 2011-09-20
7982306 Stackable semiconductor package Young Wook Heo 2011-07-19
7737542 Stackable semiconductor package Young Wook Heo 2010-06-15
7691745 Land patterns for a semiconductor stacking structure and method therefor Mahmoud Dreiza 2010-04-06
7652361 Land patterns for a semiconductor stacking structure and method therefor Mahmoud Dreiza, James William Griffith Turner 2010-01-26
7459349 Method of forming a stack of semiconductor packages Young Wook Heo 2008-12-02
7429799 Land patterns for a semiconductor stacking structure and method therefor Mahmoud Dreiza 2008-09-30
7154171 Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor 2006-12-26