Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159820 | Flat no-lead package with surface mounted structure | Rennier Rodriguez, Maiden Grace Maming | 2024-12-03 |
| 12074100 | Flat no-lead package with surface mounted structure | Rennier Rodriguez, Maiden Grace Maming | 2024-08-27 |
| 11552007 | Modified leadframe design with adhesive overflow recesses | Rennier Rodriguez, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag, Rammil Seguido | 2023-01-10 |
| 10957634 | Modified leadframe design with adhesive overflow recesses | Rennier Rodriguez, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag, Rammil Seguido | 2021-03-23 |
| 10892212 | Flat no-lead package with surface mounted structure | Rennier Rodriguez, Maiden Grace Maming | 2021-01-12 |
| 10615104 | Modified leadframe design with adhesive overflow recesses | Rennier Rodriguez, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag, Rammil Seguido | 2020-04-07 |
| 10535588 | Die with metallized sidewall and method of manufacturing | Rennier Rodriguez, Jefferson Talledo | 2020-01-14 |
| 10109563 | Modified leadframe design with adhesive overflow recesses | Rennier Rodriguez, Jefferson Talledo, Moonlord Manalo, Ela Mia Cadag, Rammil Seguido | 2018-10-23 |
| 9761538 | Method for making a shielded integrated circuit (IC) package with an electrically conductive polymer layer | Rennier Rodriguez, Frederick Arellano | 2017-09-12 |