Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11862533 | Fluid-cooled package having shielding layer | Andreas Grassmann, Wolfram Hable, Juergen Hoegerl, Ivan Nikitin | 2024-01-02 |
| 11244886 | Package cooled with cooling fluid and comprising shielding layer | Andreas Grassmann, Wolfram Hable, Juergen Hoegerl, Ivan Nikitin | 2022-02-08 |
| 10615097 | Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet | Andreas Grassmann, Wolfram Hable, Juergen Hoegerl, Angela Kessler, Ivan Nikitin | 2020-04-07 |
| 10461017 | Package with partially encapsulated cooling channel for cooling an encapsulated chip | Andreas Grassmann, Wolfram Hable, Juergen Hoegerl, Ivan Nikitin | 2019-10-29 |