JY

Jian Yin

IA Intersil Americas: 13 patents #27 of 468Top 6%
AS Alpha And Omega Semiconductor: 3 patents #16 of 69Top 25%
AC Asia Vital Components Co.: 3 patents #65 of 246Top 30%
A( Alpha And Omega Semiconductor (Cayman): 2 patents #51 of 99Top 55%
VU Vuereal: 2 patents #6 of 14Top 45%
HO Honeywell: 2 patents #4,946 of 14,447Top 35%
MC Montage Technology (Kunshan) Co.: 1 patents #12 of 28Top 45%
SU Shenzhen University: 1 patents #194 of 508Top 40%
UK University Of Hong Kong: 1 patents #170 of 561Top 35%
AC Asia Vital Components (China) Co.: 1 patents #23 of 62Top 40%
WC Wuxi Chipown Microelectronics Co.: 1 patents #10 of 24Top 45%
BI Battelle Memorial Institute: 1 patents #1,360 of 2,462Top 60%
MS Monolithic Power Systems: 1 patents #121 of 198Top 65%
📍 San Ramon, CA: #102 of 2,140 inventorsTop 5%
🗺 California: #14,433 of 386,348 inventorsTop 4%
Overall (All Time): #100,103 of 4,157,543Top 3%
34
Patents All Time

Issued Patents All Time

Showing 26–34 of 34 patents

Patent #TitleCo-InventorsDate
9723766 Power supply module with electromagnetic-interference (EMI) shielding, cooling, or both shielding and cooling, along two or more sides Nikhil Vishwanath Kelkar, Michael Althar 2017-08-01
9720429 Sensing a switching-power-supply phase current Shuai Jiang 2017-08-01
9717146 Circuit module such as a high-density lead frame array (HDA) power module, and method of making same Nikhil Vishwanath Kelkar, Loyde M. Carpenter, Jr., Nattorn Pongratananukul, Patrick J. Selby, Steven R. Rivet +1 more 2017-07-25
9696739 Sensing a switching-power-supply phase current Shuai Jiang 2017-07-04
9659183 Pattern for secure store Qi Zhu, Fei Jing 2017-05-23
9613889 Packaged circuit with a lead frame and laminate substrate Nikhil Vishwanath Kelkar, Loyde M. Carpenter, Jr. 2017-04-04
9183153 Method and system for managing power grid data Bora Akyol, Ian Gorton 2015-11-10
9012267 Method of manufacturing a packaged circuit including a lead frame and a laminate substrate Nikhil Vishwanath Kelkar, Loyde M. Carpenter, Jr. 2015-04-21
8064202 Sandwich structure with double-sided cooling and EMI shielding Hunt Hang Jiang, Kaiwei Yao 2011-11-22