Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10582617 | Method of fabricating a circuit module | Jian Yin, Nikhil Vishwanath Kelkar, Loyde M. Carpenter, Jr., Nattorn Pongratananukul, Patrick J. Selby +1 more | 2020-03-03 |
| 10290618 | Back-to-back stacked dies | Francois Hebert, Michael Althar, Peter Oaklander | 2019-05-14 |
| 9717146 | Circuit module such as a high-density lead frame array (HDA) power module, and method of making same | Jian Yin, Nikhil Vishwanath Kelkar, Loyde M. Carpenter, Jr., Nattorn Pongratananukul, Patrick J. Selby +1 more | 2017-07-25 |
| 9524957 | Back-to-back stacked dies | Francois Hebert, Michael Althar, Peter Oaklander | 2016-12-20 |