Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11150710 | Apparatuses and methods for encapsulated devices | Randolph Cruz, Mark A. Kwoka | 2021-10-19 |
| 10582617 | Method of fabricating a circuit module | Jian Yin, Nikhil Vishwanath Kelkar, Nattorn Pongratananukul, Patrick J. Selby, Steven R. Rivet +1 more | 2020-03-03 |
| 10317965 | Apparatuses and methods for encapsulated devices | Randolph Cruz, Mark A. Kwoka | 2019-06-11 |
| 9717146 | Circuit module such as a high-density lead frame array (HDA) power module, and method of making same | Jian Yin, Nikhil Vishwanath Kelkar, Nattorn Pongratananukul, Patrick J. Selby, Steven R. Rivet +1 more | 2017-07-25 |
| 9627297 | Solder flow-impeding plug on a lead frame | Randolph Cruz | 2017-04-18 |
| 9613889 | Packaged circuit with a lead frame and laminate substrate | Jian Yin, Nikhil Vishwanath Kelkar | 2017-04-04 |
| 9536852 | Lead frame having a perimeter recess within periphery of component terminal | Randolph Cruz | 2017-01-03 |
| 9177896 | Solder flow-impeding plug on a lead frame | Randolph Cruz | 2015-11-03 |
| 9018746 | Solder flow impeding feature on a lead frame | Randolph Cruz | 2015-04-28 |
| 9012267 | Method of manufacturing a packaged circuit including a lead frame and a laminate substrate | Jian Yin, Nikhil Vishwanath Kelkar | 2015-04-21 |
| 8969137 | Solder flow-impeding plug on a lead frame | Randolph Cruz | 2015-03-03 |
| 8877564 | Solder flow impeding feature on a lead frame | Randolph Cruz | 2014-11-04 |
| 8871572 | Lead frame having a perimeter recess within periphery of component terminal | Randolph Cruz | 2014-10-28 |
| 8206836 | Tie-bar configuration for leadframe type carrier strips | Randolph Cruz, Nikhil Vishwanath Kelkar | 2012-06-26 |