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USPTO Patent Rankings Data through Dec 31, 2025
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Philip H. Chen — 13 Patents

INIntermedics: 6 patents #14 of 121Top 15%
MIMiradia: 5 patents #12 of 30Top 40%
SISulzer Intermedics: 1 patents #23 of 46Top 50%
Angleton, TX: #11 of 205 inventorsTop 6%
Texas: #11,592 of 125,132 inventorsTop 10%
Overall (All Time): #362,438 of 4,157,543Top 9%
13 Patents All Time
Philip H. Chen has been granted 13 US patents while listed as an inventor at Intermedics. The first was granted in 1999 and the most recent in December 2025. Philip H. Chen ranks #362,438 of 4,157,543 US inventors in our database (top 8.7%). Patent records list Philip H. Chen in Angleton, TX, US.

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
D1107670 Showerhead for a substrate processing system Eli Jeon, Daniel Boatright, Deepak Kumar Poddar, Kyle Watt Hart, Douglas Walter Agnew +1 more 2025-12-30
9006878 Method and device for wafer scale packaging of optical devices using a scribe and break process Xiao Yang, Dongmin Chen 2015-04-14
7833879 Low temperature hermetic bonding at water level and method of bonding for micro display application 2010-11-16
7825519 Method and device for wafer scale packaging of optical devices using a scribe and break process Xiao Yang, Dongmin Chen 2010-11-02
7585747 Low temperature hermetic bonding at water level and method of bonding for micro display application 2009-09-08
7344956 Method and device for wafer scale packaging of optical devices using a scribe and break process Xiao Yang, Dongmin Chen 2008-03-18
6426880 Surface mounted device with grooves on a termination lead 2002-07-30
6406940 Method and apparatus for stacking IC devices 2002-06-18
6251219 Method and apparatus for use in assembling electronic devices Dennis M. Gibson, Cuong Pham 2001-06-26
6246587 Surface mounted device with grooves on a termination lead and methods of assembly 2001-06-12
6182357 Method and apparatus for dicing electronic substrate John C. Munson, Timothy M. Gadd 2001-02-06
5987358 Semiconductor device packaging and method of fabrication Thomas G. Sosebee, Dennis M. Gibson, Kenneth R. Ulmer 1999-11-16
5963429 Printed circuit substrate with cavities for encapsulating integrated circuits 1999-10-05