Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9006878 | Method and device for wafer scale packaging of optical devices using a scribe and break process | Xiao Yang, Dongmin Chen | 2015-04-14 |
| 7833879 | Low temperature hermetic bonding at water level and method of bonding for micro display application | — | 2010-11-16 |
| 7825519 | Method and device for wafer scale packaging of optical devices using a scribe and break process | Xiao Yang, Dongmin Chen | 2010-11-02 |
| 7585747 | Low temperature hermetic bonding at water level and method of bonding for micro display application | — | 2009-09-08 |
| 7344956 | Method and device for wafer scale packaging of optical devices using a scribe and break process | Xiao Yang, Dongmin Chen | 2008-03-18 |
| 6426880 | Surface mounted device with grooves on a termination lead | — | 2002-07-30 |
| 6406940 | Method and apparatus for stacking IC devices | — | 2002-06-18 |
| 6251219 | Method and apparatus for use in assembling electronic devices | Dennis M. Gibson, Cuong Pham | 2001-06-26 |
| 6246587 | Surface mounted device with grooves on a termination lead and methods of assembly | — | 2001-06-12 |
| 6182357 | Method and apparatus for dicing electronic substrate | John C. Munson, Timothy M. Gadd | 2001-02-06 |
| 5987358 | Semiconductor device packaging and method of fabrication | Thomas G. Sosebee, Dennis M. Gibson, Kenneth R. Ulmer | 1999-11-16 |
| 5963429 | Printed circuit substrate with cavities for encapsulating integrated circuits | — | 1999-10-05 |