Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and device for wafer scale packaging of optical devices using a scribe and break process

Method and device for wafer scale packaging of optical devices using a scribe and break process

US Patent 7825519 · Granted Nov 2, 2010

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Showerhead for a substrate processing system2025
Semiconductor structure and method of manufacturing the same2021
Heterojunction oxide non-volatile memory device2018
Methods and structures of integrated MEMS-CMOS devices2018
System configured for integrated communication, MEMS, Processor, and application2017
Method and device for estimating orientation field of fingerprint2017
Complementary metal oxide heterojunction memory devices and methods related ther2017
Heterojunction oxide non-volatile memory device2016
System on a chip using integrated MEMS and CMOS devices2016
Method for registering fingerprint image2016
Heterojunction oxide non-volatile memory devices2016
Methods and structures of integrated MEMS-CMOS devices2016