Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476168 | Die stack override for die testing | Rehan Sheikh, Michael T. Klinglesmith, Sukhbinder Takhar, Shi Hou Chong, Kok Hin Oon +3 more | 2022-10-18 |
| 11257560 | Test architecture for die to die interconnect for three dimensional integrated circuits | Sreejit Chakravarty, Fei Su, Puneet Gupta, Wei Ming Lim, Amit Sanghani +4 more | 2022-02-22 |
| 10236076 | Methods and apparatus for predictable protocol aware testing on memory interface | Wei Ming Lim, Madhu Rao, Alvin Shing Chye Goh, Kim Leong Lee, Vui Yong Liew +1 more | 2019-03-19 |
| 10139445 | High speed I/O pinless structural testing | Chin Keat Teoh, Satheesh Chellappan, Lay Cheng Ong | 2018-11-27 |