Issued Patents All Time
Showing 26–49 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6797085 | Metallurgically enhanced heat sink | Prateek Dujari, Bin Lian, Damion Searls | 2004-09-28 |
| 6793503 | Ganged land grid array socket contacts for improved power delivery | Weston Roth, Damion Searls | 2004-09-21 |
| 6793505 | Ganged land grid array socket contacts for improved power delivery | Weston Roth, Damion Searls | 2004-09-21 |
| 6774310 | Surface mount connector lead | Prateek Dujari, Bin Lian, Damion Searls | 2004-08-10 |
| 6752204 | Iodine-containing thermal interface material | Prateek Dujari, Bin Lian, Damion Searls | 2004-06-22 |
| 6730860 | Electronic assembly and a method of constructing an electronic assembly | Damion Searls, James Jackson | 2004-05-04 |
| 6682802 | Selective PCB stiffening with preferentially oriented fibers | George Hsieh, Scott Dixon | 2004-01-27 |
| 6672370 | Apparatus and method for passive phase change thermal management | Damion Searls, David Pullen | 2004-01-06 |
| 6630631 | Apparatus and method for interconnection between a component and a printed circuit board | Carolyn R. McCormick | 2003-10-07 |
| 6627822 | Electronic assembly with separate power and signal connections | James Jackson, Damion Searls | 2003-09-30 |
| 6614657 | Heat sink for cooling an electronic component of a computer | Damion Searls, James Jackson | 2003-09-02 |
| 6594151 | Frame support for a printed board assembly | Scott Dixon, George Hsieh | 2003-07-15 |
| 6580608 | Method and apparatus for thermally controlling multiple electronic components | Damion Searls, James Jackson, Thomas Morgan, Roth O. Weston | 2003-06-17 |
| 6550531 | Vapor chamber active heat sink | Damion Searls, Prateek Dujari, Bin Lian | 2003-04-22 |
| 6486589 | Circuit card assembly having controlled vibrational properties | Prateek Dujari, Bin Lian, Damion Searls | 2002-11-26 |
| 6461891 | Method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple | Paul W. Churilla, David Pullen | 2002-10-08 |
| 6452502 | Method and apparatus for early detection of reliability degradation of electronic devices | David Pullen, Gregory F. Taylor | 2002-09-17 |
| 6441675 | Method and apparatus for detection of electrical overstress | David Pullen | 2002-08-27 |
| 6433616 | Method and apparatus for detection of electrical overstress | David Pullen | 2002-08-13 |
| 6366209 | Method and apparatus for early detection of reliability degradation of electronic devices | David Pullen | 2002-04-02 |
| 6359372 | Circuit card assembly having controlled expansion properties | Prateek Dujari, Bin Lian, Damion Searls | 2002-03-19 |
| 6327145 | Heat sink with integrated fluid circulation pump | Bin Lian, Damion Searls, Prateek Dujari | 2001-12-04 |
| 6255893 | Method and apparatus for detection of electrical overstress | David Pullen | 2001-07-03 |
| 6094144 | Method and apparatus for early detection of reliability degradation of electronic devices | David Pullen | 2000-07-25 |