Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9397016 | Flip chip assembly process for ultra thin substrate and package on package assembly | Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Kang Eu Ong +1 more | 2016-07-19 | $7,217,000 |
| 8258019 | Flip chip assembly process for ultra thin substrate and package on package assembly | Weng Khoon Mong, A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Kang Eu Ong +1 more | 2012-09-04 | $13,616,000 |