Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9269686 | Debond interconnect structures | Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan +2 more | 2016-02-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9269686 | Debond interconnect structures | Qing Ma, Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan +2 more | 2016-02-23 |