Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315805 | Self-aligned lateral contacts | Andy Wei, Yang-Chun Cheng, Guillaume Bouche | 2025-05-27 |
| 11443983 | Void-free high aspect ratio metal alloy interconnects and method of manufacture using a solvent-based etchant | Sirikarn Surawanvijit, Biswadeep Saha, Erica J. Thompson | 2022-09-13 |
| 9123706 | Electroless filled conductive structures | Daniel J. Zierath, Chi-Hwa Tsang | 2015-09-01 |
| 7622382 | Filling narrow and high aspect ratio openings with electroless deposition | Chi-Hwa Tsang | 2009-11-24 |
| 7432200 | Filling narrow and high aspect ratio openings using electroless deposition | Chi-Hwa Tsang | 2008-10-07 |
| 7220296 | Electroless plating baths for high aspect features | Matthew R. Bauer, Jeff Grunes, Soley Ozer | 2007-05-22 |