RL

Richard Scott List

IN Intel: 11 patents #3,700 of 30,777Top 15%
TI Texas Instruments: 3 patents #4,047 of 12,488Top 35%
HT Hyde Tools: 1 patents #14 of 28Top 50%
Overall (All Time): #278,418 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7960226 Method of forming on-chip decoupling capacitor with bottom electrode layer having surface roughness Bruce A. Block, Ruitao Zhang 2011-06-14
7893481 Top electrode barrier for on-chip die de-coupling capacitor and method of making same Bruce A. Block, Ruitao Zhang 2011-02-22
7843036 Enhanced on-chip decoupling capacitors and method of making same Bruce A. Block 2010-11-30
7416954 Enhanced on-chip decoupling capacitors and method of making same Bruce A. Block 2008-08-26
7256089 Top electrode barrier for on-chip die de-coupling capacitor and method of making same Bruce A. Block, Ruitao Zhang 2007-08-14
7138678 Enhanced on-chip decoupling capacitors and method of making same Bruce A. Block 2006-11-21
7033882 Method of forming on-chip decoupling capacitor by selectively etching grain boundaries in electrode Bruce A. Block, Ruitao Zhang 2006-04-25
6888716 On-die de-coupling capacitor using bumps or bars Bruce A. Block, Mark Bohr 2005-05-03
6800928 Porous integrated circuit dielectric with decreased surface porosity Wei William Lee, Changming Jin 2004-10-05
6784121 Integrated circuit dielectric and method Changming Jin, Joseph D. Luttmer 2004-08-31
6737699 Enhanced on-chip decoupling capacitors and method of making same Bruce A. Block 2004-05-18
6737728 On-chip decoupling capacitor and method of making same Bruce A. Block, Ruitao Zhang 2004-05-18
6706584 On-die de-coupling capacitor using bumps or bars and method of making same Bruce A. Block, Mark Bohr 2004-03-16
6204200 Process scheme to form controlled airgaps between interconnect lines to reduce capacitance Benjamin Shieh, Somnath Nag 2001-03-20
6127203 Thermoplastic mounting of a semiconductor die to a substrate having a mismatched coefficient of thermal expansion Chang-Feng Wan, Curtis Gene Garrett, Dwight U. Bartholomew 2000-10-03
5959340 Thermoplastic mounting of a semiconductor die to a substrate having a mismatched coefficient of thermal expansion Chang-Feng Wan, Curtis Gene Garrett, Dwight U. Bartholomew 1999-09-28
5850657 Woodworking tool for preparing a wood surface for finishing Andre J. Lazure, Mark S. Corriveau, Steven J. Corron 1998-12-22