Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7960226 | Method of forming on-chip decoupling capacitor with bottom electrode layer having surface roughness | Bruce A. Block, Ruitao Zhang | 2011-06-14 |
| 7893481 | Top electrode barrier for on-chip die de-coupling capacitor and method of making same | Bruce A. Block, Ruitao Zhang | 2011-02-22 |
| 7843036 | Enhanced on-chip decoupling capacitors and method of making same | Bruce A. Block | 2010-11-30 |
| 7416954 | Enhanced on-chip decoupling capacitors and method of making same | Bruce A. Block | 2008-08-26 |
| 7256089 | Top electrode barrier for on-chip die de-coupling capacitor and method of making same | Bruce A. Block, Ruitao Zhang | 2007-08-14 |
| 7138678 | Enhanced on-chip decoupling capacitors and method of making same | Bruce A. Block | 2006-11-21 |
| 7033882 | Method of forming on-chip decoupling capacitor by selectively etching grain boundaries in electrode | Bruce A. Block, Ruitao Zhang | 2006-04-25 |
| 6888716 | On-die de-coupling capacitor using bumps or bars | Bruce A. Block, Mark Bohr | 2005-05-03 |
| 6800928 | Porous integrated circuit dielectric with decreased surface porosity | Wei William Lee, Changming Jin | 2004-10-05 |
| 6784121 | Integrated circuit dielectric and method | Changming Jin, Joseph D. Luttmer | 2004-08-31 |
| 6737699 | Enhanced on-chip decoupling capacitors and method of making same | Bruce A. Block | 2004-05-18 |
| 6737728 | On-chip decoupling capacitor and method of making same | Bruce A. Block, Ruitao Zhang | 2004-05-18 |
| 6706584 | On-die de-coupling capacitor using bumps or bars and method of making same | Bruce A. Block, Mark Bohr | 2004-03-16 |
| 6204200 | Process scheme to form controlled airgaps between interconnect lines to reduce capacitance | Benjamin Shieh, Somnath Nag | 2001-03-20 |
| 6127203 | Thermoplastic mounting of a semiconductor die to a substrate having a mismatched coefficient of thermal expansion | Chang-Feng Wan, Curtis Gene Garrett, Dwight U. Bartholomew | 2000-10-03 |
| 5959340 | Thermoplastic mounting of a semiconductor die to a substrate having a mismatched coefficient of thermal expansion | Chang-Feng Wan, Curtis Gene Garrett, Dwight U. Bartholomew | 1999-09-28 |
| 5850657 | Woodworking tool for preparing a wood surface for finishing | Andre J. Lazure, Mark S. Corriveau, Steven J. Corron | 1998-12-22 |