Richard Scott List — 17 Patents at Intel

Richard Scott List has been granted 17 US patents while listed as an inventor at Intel. The first was granted in 1998 and the most recent in June 2011. Richard Scott List ranks #263,971 of 4,157,543 US inventors in our database (top 6.3%). Patent records list Richard Scott List in Northborough, MA, US.

Patents per Year

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Showing 1–17 of 17 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
7960226	Method of forming on-chip decoupling capacitor with bottom electrode layer having surface roughness	Bruce A. Block, Ruitao Zhang	2011-06-14	$17,389,000
7893481	Top electrode barrier for on-chip die de-coupling capacitor and method of making same	Bruce A. Block, Ruitao Zhang	2011-02-22	$16,036,000
7843036	Enhanced on-chip decoupling capacitors and method of making same	Bruce A. Block	2010-11-30	$13,201,000
7416954	Enhanced on-chip decoupling capacitors and method of making same	Bruce A. Block	2008-08-26	$24,347,000
7256089	Top electrode barrier for on-chip die de-coupling capacitor and method of making same	Bruce A. Block, Ruitao Zhang	2007-08-14	$18,880,000
7138678	Enhanced on-chip decoupling capacitors and method of making same	Bruce A. Block	2006-11-21	$16,835,000
7033882	Method of forming on-chip decoupling capacitor by selectively etching grain boundaries in electrode	Bruce A. Block, Ruitao Zhang	2006-04-25	$12,896,000
6888716	On-die de-coupling capacitor using bumps or bars	Bruce A. Block, Mark Bohr	2005-05-03	$20,343,000
6800928	Porous integrated circuit dielectric with decreased surface porosity	Wei William Lee, Changming Jin	2004-10-05	$16,258,000
6784121	Integrated circuit dielectric and method	Changming Jin, Joseph D. Luttmer	2004-08-31	$10,407,000
6737699	Enhanced on-chip decoupling capacitors and method of making same	Bruce A. Block	2004-05-18	$30,392,000
6737728	On-chip decoupling capacitor and method of making same	Bruce A. Block, Ruitao Zhang	2004-05-18	$30,392,000
6706584	On-die de-coupling capacitor using bumps or bars and method of making same	Bruce A. Block, Mark Bohr	2004-03-16	$26,262,000
6204200	Process scheme to form controlled airgaps between interconnect lines to reduce capacitance	Benjamin Shieh, Somnath Nag	2001-03-20	$50,316,000
6127203	Thermoplastic mounting of a semiconductor die to a substrate having a mismatched coefficient of thermal expansion	Chang-Feng Wan, Curtis Gene Garrett, Dwight U. Bartholomew	2000-10-03	$1,914,000
5959340	Thermoplastic mounting of a semiconductor die to a substrate having a mismatched coefficient of thermal expansion	Chang-Feng Wan, Curtis Gene Garrett, Dwight U. Bartholomew	1999-09-28	$1,156,000
5850657	Woodworking tool for preparing a wood surface for finishing	Andre J. Lazure, Mark S. Corriveau, Steven J. Corron	1998-12-22

Richard Scott List — 17 Patents

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