Issued Patents All Time
Showing 26–43 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6697553 | Compact, low insertion loss, high yield arrayed waveguide grating | Jyoti Kiron Bhardwaj, Robert J. Brainard, David J. Chapman, Zi-Wen Dong, David J. Dougherty +13 more | 2004-02-24 |
| 6692161 | High frequency emitter and detector packaging scheme for 10GB/S transceiver | Brett M. Zaborsky, Rao S. Peddada, Andrew C. Alduino, Siegfried Fleischer | 2004-02-17 |
| 6694076 | Method for centering a core of a waveguide amplifier | — | 2004-02-17 |
| 6664511 | Package for optical components | James F. Farrell, Mark Farrelly, Suresh Ramalingam, Kenzo Ishida | 2003-12-16 |
| 6628865 | Alignment of optical fibers to an etched array waveguide | — | 2003-09-30 |
| 6621967 | Eccentricity detect and alignment for fiberoptic bundle | — | 2003-09-16 |
| 6606425 | Transfer molded packages with embedded thermal insulation | Kenzo Ishida, David J. Chapman, Duane Cook, James F. Farrell, Suresh Ramalingam +1 more | 2003-08-12 |
| 6583388 | High thermal efficiency, small form-factor packages including thermally insulative cavities, and transfer molded variants | David J. Chapman, Steven M. Swain | 2003-06-24 |
| 6556764 | Apparatus and method for holding an optical fiber component during optical fiber alignment | — | 2003-04-29 |
| 6493493 | Eccentricity detect and alignment for fiberoptic bundle | — | 2002-12-10 |
| 6486440 | Redundant package for optical components | James F. Farrell, Mark Farrelly, Suresh Ramalingam | 2002-11-26 |
| 6483174 | Apparatus and method for dicing and testing optical devices, including thin film filters | Mark D. Moravec, Scott Pallady | 2002-11-19 |
| 5871626 | Flexible continuous cathode contact circuit for electrolytic plating of C4, TAB microbumps, and ultra large scale interconnects | Steven M. Swain, Kenji Takahashi, Hirofumi Ishida | 1999-02-16 |
| 5807469 | Flexible continuous cathode contact circuit for electrolytic plating of C4, tab microbumps, and ultra large scale interconnects | Steven M. Swain, Kenji Takahashi, Hirofumi Ishida | 1998-09-15 |
| 5492235 | Process for single mask C4 solder bump fabrication | Venkatesan Murali, Caroline Susan Lee | 1996-02-20 |
| 5257162 | Bellows lid for c4 flip-chip package | — | 1993-10-26 |
| 5115842 | Apparatus for delivery of a liquid | Mark Leonov | 1992-05-26 |
| 4868992 | Anode cathode parallelism gap gauge | Mark Leonov | 1989-09-26 |