Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10732556 | Image forming apparatus and management method for image forming apparatus | — | 2020-08-04 |
| 10394157 | Image forming apparatus | — | 2019-08-27 |
| 10054869 | Image forming apparatus for detecting crack generated in charging member, method for controlling the image forming apparatus, and control program used in the image forming apparatus | — | 2018-08-21 |
| 9841708 | Image forming apparatus having power supply that applies reverse-bias voltage to transfer member | — | 2017-12-12 |
| 9783429 | Method for purifying dodecacarbonyl triruthenium | Hirofumi Nakagawa, Tasuku ISHIZAKA, Akiko Kumakura | 2017-10-10 |
| 9499411 | Device for producing and method for producing dodecacarbonyl triruthenium | Hirofumi Nakagawa, Tasuku ISHIZAKA, Ken Hagiwara, Akiko Kumakura | 2016-11-22 |
| 9081360 | Image formation apparatus | — | 2015-07-14 |
| 8620191 | Developing device and image formation apparatus | Futoshi Okazaki | 2013-12-31 |
| 7665565 | Support structure for control pedal of vehicle | Masayuki Tokumo, Tetsuo Hiura | 2010-02-23 |
| 7179359 | Cup-shaped plating apparatus | — | 2007-02-20 |
| 6736945 | Wafer plating apparatus | Yoshiyuki Harima | 2004-05-18 |
| 6456283 | Method and system for generating image in computer graphics | — | 2002-09-24 |
| 6224670 | Cup-type plating method and cleaning apparatus used therefor | — | 2001-05-01 |
| 5871626 | Flexible continuous cathode contact circuit for electrolytic plating of C4, TAB microbumps, and ultra large scale interconnects | Douglas E. Crafts, Steven M. Swain, Kenji Takahashi | 1999-02-16 |
| 5853636 | Fiber treatment composition | Takeshi Munekiyo, Tamotsu Matsunaga | 1998-12-29 |
| 5807469 | Flexible continuous cathode contact circuit for electrolytic plating of C4, tab microbumps, and ultra large scale interconnects | Douglas E. Crafts, Steven M. Swain, Kenji Takahashi | 1998-09-15 |
| 5447615 | Plating device for wafer | — | 1995-09-05 |
| 5429733 | Plating device for wafer | — | 1995-07-04 |