Issued Patents All Time
Showing 101–119 of 119 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6027980 | Method of forming a decoupling capacitor | — | 2000-02-22 |
| 5973910 | Decoupling capacitor in an integrated circuit | — | 1999-10-26 |
| 5930668 | Process of fabricating embedded ground plane and shielding structures using sidewall insulators in high frequency circuits having vias | — | 1999-07-27 |
| 5909635 | Cladding of an interconnect for improved electromigration performance | Thomas Marieb, Quat Vu | 1999-06-01 |
| 5891803 | Rapid reflow of conductive layers by directional sputtering for interconnections in integrated circuits | — | 1999-04-06 |
| 5817574 | Method of forming a high surface area interconnection structure | — | 1998-10-06 |
| 5783483 | Method of fabricating a barrier against metal diffusion | — | 1998-07-21 |
| 5719447 | Metal alloy interconnections for integrated circuits | — | 1998-02-17 |
| 5679982 | Barrier against metal diffusion | — | 1997-10-21 |
| 5654232 | Wetting layer sidewalls to promote copper reflow into grooves | — | 1997-08-05 |
| 5612254 | Methods of forming an interconnect on a semiconductor substrate | Xiao-Chun Mu, Srinivasan Sivaram, David B. Fraser | 1997-03-18 |
| 5583739 | Capacitor fabricated on a substrate containing electronic circuitry | Quat Vu | 1996-12-10 |
| 5472900 | Capacitor fabricated on a substrate containing electronic circuitry | Quat Vu | 1995-12-05 |
| 5444022 | Method of fabricating an interconnection structure for an integrated circuit | — | 1995-08-22 |
| 5414221 | Embedded ground plane and shielding structures using sidewall insulators in high frequency circuits having vias | — | 1995-05-09 |
| 5386088 | Embedded ground plane and shielding structures using sidewall insulators in high frequency circuits having vias | — | 1995-01-31 |
| 5350484 | Method for the anisotropic etching of metal films in the fabrication of interconnects | Xiao-Chun Mu, David B. Fraser | 1994-09-27 |
| 5285017 | Embedded ground plane and shielding structures using sidewall insulators in high frequency circuits having vias | — | 1994-02-08 |
| 4673623 | Layered and homogeneous films of aluminum and aluminum/silicon with titanium and tungsten for multilevel interconnects | Krishna C. Saraswat, Troy W. Barbee, Jr. | 1987-06-16 |