Issued Patents All Time
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7880300 | Semiconductor chip comprising a metal coating structure and associated production method | Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler | 2011-02-01 |
| 7834467 | Layer between interfaces of different components in semiconductor devices | Michael Bauer, Alfred Haimerl, Khalil Hosseini, Angela Kessler, Joachim Mahler | 2010-11-16 |
| 7791177 | Electronic device | Angela Wieneke Kessler, Roman Peters | 2010-09-07 |
| 7768107 | Semiconductor component including semiconductor chip and method for producing the same | Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler | 2010-08-03 |
| 7749797 | Semiconductor device having a sensor chip, and method for producing the same | Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler | 2010-07-06 |
| 7728053 | Plastic housing composition for embedding semiconductor devices in a plastic housing and use of the plastic housing composition | Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler | 2010-06-01 |
| 7714422 | Electronic module with a semiconductor chip and a component housing and methods for producing the same | Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler | 2010-05-11 |
| 7705436 | Semiconductor device with semiconductor chip and method for producing it | Joachim Mahler, Alfred Haimerl, Angela Kessler, Michael Bauer | 2010-04-27 |
| 7645642 | Method of joining a thermoplastic material to a thermoset material, and thermoplastic-thermoset composite | Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler | 2010-01-12 |
| 7629660 | Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof | Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler | 2009-12-08 |
| 7589403 | Lead structure for a semiconductor component and method for producing the same | Michael Bauer, Angela Kessler, Alfred Haimerl, Joachim Mahler | 2009-09-15 |
| 7540950 | Electrically conductive body including an adhesion promoter layer, and process for depositing an adhesion promoter layer | Edmund Riedl | 2009-06-02 |
| 7464603 | Sensor component with a cavity housing and a sensor chip and method for producing the same | Michael Bauer, Angela Kessler, Alfred Haimerl, Joachim Mahler | 2008-12-16 |
| 7462940 | Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same | Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler | 2008-12-09 |
| 7443019 | Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same | Michael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler | 2008-10-28 |
| 7384698 | Metal article intended for at least partially coating with a substance and a method for producing the same | Edmund Riedl | 2008-06-10 |
| 7230309 | Semiconductor component and sensor component for data transmission devices | Michael Bauer, Thomas Engling, Alfred Haimerl, Joachim Mahler | 2007-06-12 |