HT

Hong Hock Tay

Infineon Technologies Ag: 1 patents #4,439 of 7,486Top 60%
📍 Muar, MY: #8 of 12 inventorsTop 70%
Overall (All Time): #2,814,091 of 4,157,543Top 70%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10770399 Semiconductor package having a filled conductive cavity Chee Yang Ng, Hock Siang Chua, Stefan Macheiner, Josef Maerz, Nurfarena Othman +1 more 2020-09-08