Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9099454 | Molded semiconductor package with backside die metallization | Ulrich Wachter, Veronika Huber, Thomas Kilger, Ralf Otremba, Bernd Stadler +3 more | 2015-08-04 |
| 6904128 | Device for cooling surface that rotates about a rotation axis and that faces the rotation axis | Peter Tichy, Eckhard Wolfgang | 2005-06-07 |
| 6838729 | Semiconductor component with enhanced avalanche ruggedness | Markus Schmitt, Hans-Joachim Schulze, Markus Vossebürger, Armin Willmeroth | 2005-01-04 |