| 12237207 |
Method for forming a buried metal line in a semiconductor substrate |
Boon Teik Chan, Zheng Tao, Anshul Gupta, Basoene Briggs |
2025-02-25 |
| 11527431 |
Methods of semiconductor device processing |
Boon Teik Chan, Geert Mannaert |
2022-12-13 |
| 11430697 |
Method of forming a mask layer |
Boon Teik Chan, Zheng Tao |
2022-08-30 |
| 11430876 |
Method for producing self-aligned gate and source/drain via connections for contacting a FET transistor |
Boon Teik Chan, Dunja Radisic, Steven Demuynck, Soon Aik Chew |
2022-08-30 |
| 10978335 |
Method for producing a gate cut structure on an array of semiconductor fins |
Boon Teik Chan, Ryan Ryoung-Han Kim |
2021-04-13 |
| 10825682 |
Method for producing a pillar structure in a semiconductor layer |
Boon Teik Chan, Vasile Paraschiv, Zheng Tao |
2020-11-03 |
| 10784158 |
Area-selective deposition of a tantalum silicide TaSix mask material |
Boon Teik Chan |
2020-09-22 |
| 10782607 |
Reticles for lithography |
Boon Teik Chan, Kim Vu Luong, Vicky Philipsen, Kevin Vandersmissen |
2020-09-22 |
| 10493378 |
Method of forming micro-pipes on a substrate and a structure formed thereof |
Zheng Tao, Boon Teik Chan, XiuMei Xu, Khashayar Babaei Gavan |
2019-12-03 |
| 9520298 |
Plasma method for reducing post-lithography line width roughness |
Peter De Schepper, Jean-Francois de Marneffe |
2016-12-13 |
| 8883374 |
EUV photoresist encapsulation |
— |
2014-11-11 |