Issued Patents All Time
Showing 51–75 of 103 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9701872 | Picktip having non-planar topography | Paul F. Fortier, Stephane Harel, Simon Laflamme, Roch Thivierge | 2017-07-11 |
| 9706670 | Connecting mid-board electronic devices | Jerome Bougie, Paul F. Fortier, Alexander Janta-Polczynski, Stephan L. Martel | 2017-07-11 |
| 9696497 | Connecting mid-board optical modules | Edward Kimbrell, Theodore William Lichoulas | 2017-07-04 |
| 9684133 | Component assembly apparatus | Nicolas Boyer, Guy Brouilette, Paul F. Fortier, Stephane Harel, Roch Thivierge | 2017-06-20 |
| 9662830 | Bondline control fixture and method of affixing first and second components | Nicolas Boyer, Paul F. Fortier, Stephane Harel, Roch Thivierge | 2017-05-30 |
| 9656420 | Bondline control fixture and method of affixing first and second components | Nicolas Boyer, Paul F. Fortier, Stephane Harel, Roch Thivierge | 2017-05-23 |
| 9651747 | Fiber pigtail assembly with integrated lid enabling optical fiber mobility | Nicolas Boyer, Paul F. Fortier, Alexander Janta-Polczynski | 2017-05-16 |
| 9645312 | Rebalanced adiabatic optical polarization splitter | Wesley David Sacher | 2017-05-09 |
| 9625379 | Gas sensor with integrated optics and reference cell | William M. Green, Yves Martin, Jason S. Orcutt, Lionel Tombez | 2017-04-18 |
| 9606308 | Three dimensional self-alignment of flip chip assembly using solder surface tension during solder reflow | Yves Martin, Jae-Woong Nah | 2017-03-28 |
| 9568682 | Component and chip assembly structure for high yield parallelized fiber assembly | Nicolas Boyer, Paul F. Fortier, Alexander Janta-Polczynski, Stephan L. Martel, Jean-Francois Morissette | 2017-02-14 |
| 9563030 | Connector for waveguide and alignment method | Yoichi Taira | 2017-02-07 |
| 9562852 | Gas sensor with integrated optics and reference cell | William M. Green, Yves Martin, Jason S. Orcutt, Lionel Tombez | 2017-02-07 |
| 9543736 | Optimized solder pads for solder induced alignment of opto-electronic chips | Yves Martin | 2017-01-10 |
| 9482820 | Connecting mid-board optical modules | Edward Kimbrell, Theodore William Lichoulas | 2016-11-01 |
| 9466590 | Optimized solder pads for microelectronic components | Yves Martin, Jae-Woong Nah | 2016-10-11 |
| 9429718 | Single-mode polymer waveguide connector | Hidetoshi Numata, Yoichi Taira | 2016-08-30 |
| 9417404 | Single-mode polymer waveguide connector | Hidetoshi Numata, Yoichi Taira | 2016-08-16 |
| 9400356 | Fiber pigtail with integrated lid | Paul F. Fortier, Ted Lichoulas | 2016-07-26 |
| 9364925 | Assembly of electronic and optical devices | Bing Dang | 2016-06-14 |
| 9368653 | Silicon photonics integration method and structure | Solomon Assefa, William M. Green, Marwan H. Khater, Jessie C. Rosenberg, Steven M. Shank | 2016-06-14 |
| 9360635 | Dual-polymer fiber optic interface with melt-bond adhesive | Eddie Kimbrell, Ted Lichoulas | 2016-06-07 |
| 9316796 | Fiber pigtail with integrated lid | Paul F. Fortier, Ted Lichoulas | 2016-04-19 |
| 9285542 | Fiber optic interface with adhesive fill system | Eddie Kimbrell, Ted Lichoulas | 2016-03-15 |
| 9243784 | Semiconductor photonic package | Paul F. Fortier, Stephane Harel, Yurii A. Vlasov | 2016-01-26 |