Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7834457 | Bilayer metal capping layer for interconnect applications | Chih-Chao Yang | 2010-11-16 |
| 7830010 | Surface treatment for selective metal cap applications | Chih-Chao Yang, Sampath Purushothaman, Muthumanickam Sankarapandian | 2010-11-09 |
| 7393776 | Method of forming closed air gap interconnects and structures formed thereby | Matthew E. Colburn, Timothy J. Dalton, Elbert E. Huang, Sampath Purushothaman, Katherine L. Saenger +2 more | 2008-07-01 |
| 7361991 | Closed air gap interconnect structure | Simon Karecki, Maheswaran Surendra, Sampath Purushothaman, Matthew E. Colburn, Timothy J. Dalton +2 more | 2008-04-22 |
| 7309649 | Method of forming closed air gap interconnects and structures formed thereby | Simon Karecki, Timothy J. Dalton, Elbert E. Huang, Sampath Purushothaman, Katherine L. Saenger +2 more | 2007-12-18 |
| 7268432 | Interconnect structures with engineered dielectrics with nanocolumnar porosity | Matthew E. Colburn, Sampath Purushothaman, Charles T. Black, Kathryn Guarini | 2007-09-11 |
| 7045453 | Very low effective dielectric constant interconnect structures and methods for fabricating the same | Donald F. Canaperi, Timothy J. Dalton, Stephen M. Gates, Mahadevaiyer Krishnan, Sampath Purushothaman +1 more | 2006-05-16 |
| 7023093 | Very low effective dielectric constant interconnect Structures and methods for fabricating the same | Donald F. Canaperi, Timothy J. Dalton, Stephen M. Gates, Mahadevaiyer Krishnan, Sampath Purushothaman +1 more | 2006-04-04 |