RF

Richard P. Ferlita

IBM: 2 patents #32,839 of 70,183Top 50%
📍 Wappingers Falls, NY: #479 of 884 inventorsTop 55%
🗺 New York: #48,759 of 115,490 inventorsTop 45%
Overall (All Time): #2,120,789 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
7784669 Method and process for reducing undercooling in a lead-free tin-rich solder alloy Gareth G. Hougham, Kamalesh K. Srivastava, Sung Kwon Kang, Da-Yuan Shih, Brian R. Sundlof +4 more 2010-08-31
7703661 Method and process for reducing undercooling in a lead-free tin-rich solder alloy Gareth G. Hougham, Kamalesh K. Srivastava, Sung Kwon Kang, Da-Yuan Shih, Brian R. Sundlof +4 more 2010-04-27