Issued Patents All Time
Showing 26–50 of 335 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10132433 | Releasable, threadless conduit connector for liquid manifold | Thomas J. Brunschwiler, Evan G. Colgan, Gerd Schlottig | 2018-11-20 |
| 10111364 | Coupling assemblies for connecting fluid-carrying components | Amilcar R. Arvelo, Alan F. Benner, Eric J. McKeever | 2018-10-23 |
| 10107426 | Releasable, threadless conduit connector for liquid manifold | Thomas J. Brunschwiler, Evan G. Colgan, Gerd Schlottig | 2018-10-23 |
| 10104810 | Coupling assemblies for connecting fluid-carrying components | Amilcar R. Arvelo, Alan F. Benner, Eric J. McKeever | 2018-10-16 |
| 10070560 | Drawer-level immersion-cooling with hinged, liquid-cooled heat sink | Levi A. Campbell, Milnes P. David, Dustin W. Demetriou, Roger R. Schmidt, Robert E. Simons | 2018-09-04 |
| 10024606 | Fabricating thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s) | Amilcar R. Arvelo, Mark A. Brandon, Levi A. Campbell, Randall G. Kemink, Eric J. McKeever | 2018-07-17 |
| 10006571 | Releasable, threadless conduit connector for liquid manifold | Thomas J. Brunschwiler, Evan G. Colgan, Gerd Schlottig | 2018-06-26 |
| 9949412 | Thermoelectric-enhanced, inlet air-cooled thermal conductors | Levi A. Campbell, Milnes P. David, Dustin W. Demetriou, Roger R. Schmidt, Robert E. Simons | 2018-04-17 |
| 9904811 | Tamper-proof electronic packages with two-phase dielectric fluid | Levi A. Campbell, Milnes P. David, Dustin W. Demetriou | 2018-02-27 |
| 9890878 | Formed hose with different fiber-reinforced regions | Prabjit Singh | 2018-02-13 |
| 9865522 | Composite heat sink structures | Levi A. Campbell, Milnes P. David, Dustin W. Demetriou, Roger R. Schmidt, Robert E. Simons | 2018-01-09 |
| 9818667 | Compute intensive module packaging | Amilcar R. Arvelo, Eric J. McKeever, Thong N. Nguyen, Edward J. Seminaro | 2017-11-14 |
| 9811097 | Environmental control of liquid cooled electronics | Ravi Kumar Arimilli, Edward J. Seminaro | 2017-11-07 |
| 9795055 | Electronics cooling assembly with multi-position, airflow-blocking mechanism | Levi A. Campbell, Milnes P. David, Dustin W. Demetriou | 2017-10-17 |
| 9763357 | Fabricating a liquid-cooling apparatus with coolant filter | Levi A. Campbell, Richard C. Chu, Milnes P. David, Madhusudan K. Iyengar, Roger R. Schmidt +1 more | 2017-09-12 |
| 9761508 | Composite heat sink structures | Levi A. Campbell, Milnes P. David, Dustin W. Demetriou, Roger R. Schmidt, Robert E. Simons | 2017-09-12 |
| 9750159 | Pump-enhanced, immersion-cooling of electronic compnent(s) | Levi A. Campbell, Richard C. Chu, Milnes P. David, Madhusudan K. Iyengar, Roger R. Schmidt +1 more | 2017-08-29 |
| 9746109 | Fabricating formed hose with different fiber-reinforced regions | Prabjit Singh | 2017-08-29 |
| 9733148 | Measuring moisture leakage through liquid-carrying hardware | Michael G. Betro, Enrico A. Romano, Prabjit Singh, Jing Zhang | 2017-08-15 |
| 9726829 | Blind mating strain relieved optical fiber connector | Alan F. Benner, Mark A. Brandon, Eric J. McKeever, Thong N. Nguyen, Edward J. Seminaro | 2017-08-08 |
| 9720184 | Blind mating strain relieved optical fiber connector | Alan F. Benner, Mark A. Brandon, Eric J. McKeever, Thong N. Nguyen, Edward J. Seminaro | 2017-08-01 |
| 9687943 | Heat sink structure with a vapor-permeable membrane for two-phase cooling | Levi A. Campbell, Richard C. Chu, Milnes P. David, Madhusudan K. Iyengar, Robert E. Simons | 2017-06-27 |
| 9686891 | Thermoelectric-enhanced, inlet air cooling for an electronics rack | Levi A. Campbell, Milnes P. David, Dustin W. Demetriou, Roger R. Schmidt, Robert E. Simons | 2017-06-20 |
| 9686889 | Field-replaceable bank of immersion-cooled electronic components | Levi A. Campbell, Richard C. Chu, Milnes P. David, Madhusudan K. Iyengar, Roger R. Schmidt +1 more | 2017-06-20 |
| 9661784 | Multi-component electronic module with integral coolant-cooling | Amilcar R. Arvelo, Levi A. Campbell, Eric J. McKeever | 2017-05-23 |