Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10405421 | Selective dielectric resin application on circuitized core layers | Bruce J. Chamberlin, Scott B. King, Joseph Kuczynski | 2019-09-03 |
| 10212828 | Via stub elimination by disrupting plating | Joseph Kuczynski, Bruce J. Chamberlin, Scott B. King | 2019-02-19 |
| 10168383 | Testing printed circuit board assembly | Mark K. Hoffmeyer, Stephen M. Hugo, Mark J. Jeanson | 2019-01-01 |
| 10141703 | Connector module having insulated metal frame | Ai Kiar Ang, Curtis T. Grosskopf | 2018-11-27 |
| 10083894 | Integrated die paddle structures for bottom terminated components | Stephen M. Hugo, Mark J. Jeanson | 2018-09-25 |
| 10048312 | Testing printed circuit board assembly | Mark K. Hoffmeyer, Stephen M. Hugo, Mark J. Jeanson | 2018-08-14 |
| 9986649 | Increasing solder hole-fill in a printed circuit board assembly | Stephen M. Hugo | 2018-05-29 |
| 9972957 | Connector module having insulated metal frame | Ai Kiar Ang, Curtis T. Grosskopf | 2018-05-15 |
| 9966719 | Connector module having insulated metal frame | Ai Kiar Ang, Curtis T. Grosskopf | 2018-05-08 |
| 9733134 | Solder assembly temperature monitoring process | Stephen M. Hugo | 2017-08-15 |
| 9714870 | Solder assembly temperature monitoring process | Stephen M. Hugo | 2017-07-25 |
| 9662732 | Increasing solder hole-fill in a printed circuit board assembly | Stephen M. Hugo | 2017-05-30 |
| 9591795 | Sensor-based removal of a soldered device | Willie T. Davis, Jr., Michk Huang | 2017-03-07 |
| 9563739 | Technology for temperature sensitive components in thermal processing | Mitchell G. Ferrill, Curtis T. Grosskopf, Thomas H. Lewis, Wen Wei Low | 2017-02-07 |
| 9427828 | Increasing solder hole-fill in a printed circuit board assembly | Stephen M. Hugo | 2016-08-30 |
| 9317643 | Technology for temperature sensitive components in thermal processing | Mitchell G. Ferrill, Curtis T. Grosskopf, Thomas H. Lewis, Wen Wei Low | 2016-04-19 |
| 9232664 | Heat transfer device for wave soldering | Stephen M. Hugo | 2016-01-05 |
| 9148962 | Heat transfer device for wave soldering | Stephen M. Hugo | 2015-09-29 |
| 8299393 | Selective thermal conditioning components on a PCB | Kirit Shah, Thomas S. Truman | 2012-10-30 |
| 7856341 | Heat sink | Brian L. Carlson, Bruce J. Chamberlin, Mark K. Hoffmeyer, Ahmad D. Katnani, Gregory S. Killinger +3 more | 2010-12-21 |