JK

Joseph Kuczynski

IBM: 514 patents #18 of 70,183Top 1%
Globalfoundries: 6 patents #578 of 4,424Top 15%
LP Lenovo (Singapore) Pte.: 2 patents #296 of 1,012Top 30%
LE Lenovo: 1 patents #3 of 26Top 15%
📍 North Port, FL: #1 of 67 inventorsTop 2%
🗺 Florida: #1 of 67,251 inventorsTop 1%
Overall (All Time): #349 of 4,157,543Top 1%
523
Patents All Time

Issued Patents All Time

Showing 476–500 of 523 patents

Patent #TitleCo-InventorsDate
8366229 Indication of print media quality to printer users Hye Suk Makley, Melissa K. Miller, Heidi D. Williams, Jing Zhang 2013-02-05
8323980 Early warning sulfur detection based on change in fluorescence intensity of polymer-bound phosphine compound Dylan J. Boday, Robert E. Meyer, III 2012-12-04
8268251 Early warning sulfur detection based on change in fluorescence intensity of polymer-bound phosphine compound Dylan J. Boday, Robert E. Meyer, III 2012-09-18
8251749 Implementing impedance gradient connector for board-to-board applications John R. Dangler, Matthew S. Doyle, Thomas D. Kidd, Kevin A. Splittstoesser, Timothy J. Tofil 2012-08-28
8230592 Method for via stub elimination Kevin A. Splittstoesser, Timothy J. Tofil, Paul Alan Vermilyea 2012-07-31
8136240 Method of forming a substrate having a plurality of insulator layers Kevin A. Splittstoesser, Timothy J. Tofil, Paul Alan Vermilyea 2012-03-20
8007291 Implementing differential signal circuit board electrical contact Don A. Gilliland, Amanda E. Mikhail 2011-08-30
7968987 Carbon dioxide gettering for a chip module assembly 2011-06-28
7832096 Method for producing an organic substrate with integral thermal dissipation channels Arvind K. Sinha 2010-11-16
7760502 Cooling system employing a heat exchanger with phase change material, and method of operation thereof Robert E. Meyer, III, Cary M. Huettner, Timothy J. Tofil 2010-07-20
7632127 Socket and method for compensating for differing coefficients of thermal expansion Brian S. Beaman, Theron Lee Lewis, Amanda E. Mikhail, Arvind K. Sinha 2009-12-15
7619867 Conformal coating enhanced to provide heat detection Dale Christensen, Nicholas Poleschuk 2009-11-17
7530853 Socket and method for compensating for differing coefficients of thermal expansion Brian S. Beaman, Theron Lee Lewis, Amanda E. Mikhail, Arvind K. Sinha 2009-05-12
7512299 Fiber optic cable systems and methods incorporating a luminescent compound-containing layer to identify cracks Jessica Berens, Lad W. Freitag, Fraser Allan Syme 2009-03-31
7497713 Automatically adjustable connector to accommodate circuit board of varying thickness Cary M. Huettner, Robert E. Meyer, Mark D. Plucinski, Timothy J. Tofil 2009-03-03
7488192 Apparatus and method that minimizing dimensional instability and solder stress in surface mounted interconnections Jason R. Eagle, Christopher M. Marroquin, Amanda E. Mikhail 2009-02-10
7489596 Methods and apparatus capable of indicating elapsed time intervals David Otto Lewis 2009-02-10
7479590 Dry adhesives, methods of manufacture thereof and articles comprising the same 2009-01-20
7472477 Method for manufacturing a socket that compensates for differing coefficients of thermal expansion Brian S. Beaman, Theron Lee Lewis, Amanda E. Mikhail, Arvind K. Sinha 2009-01-06
7462506 Carbon dioxide gettering method for a chip module assembly 2008-12-09
7382620 Method and apparatus for optimizing heat transfer with electronic components Vijayeshwar D. Khanna, Arvind K. Sinha, Sri M. Sri-Jayantha 2008-06-03
7356228 Fiber optic cable systems and methods incorporating a luminescent compound-containing layer to identify cracks Jessica Berens, Lad W. Freitag, Fraser Allan Syme 2008-04-08
7317514 System and method for optimizing heat management Arvind K. Sinha, Kevin A. Splittstoesser, Timothy J. Tofil, Paul Alan Vermilyea 2008-01-08
7303443 Socket and method for compensating for differing coefficients of thermal expansion Brian S. Beaman, Theron Lee Lewis, Amanda E. Mikhail, Arvind K. Sinha 2007-12-04
7298623 Organic substrate with integral thermal dissipation channels, and method for producing same Arvind K. Sinha 2007-11-20