Issued Patents All Time
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10551240 | Self-cleaning liquid level sensor | Daniel Piper, Jang Sim, Yongchun Xin | 2020-02-04 |
| 10545493 | Enhanced service procedures using force measurement | Jonathan D. Bradbury, Michael R. Kane, Jeffrey Nettey | 2020-01-28 |
| 10533919 | Electro-mechanical fuse for detecting monitored component deflection | Jonathan D. Bradbury, Michael R. Kane | 2020-01-14 |
| 10528817 | Smart display apparatus and control system | Marc A. Bergendahl, Christopher J. Penny, James J. Demarest, Christopher J. Waskiewicz, Jean Wynne | 2020-01-07 |
| 10504807 | Time temperature monitoring system | Taryn J. Davis, Terence L. Kane, Christopher F. Klabes, Andrew J. Martin, Vincent J. McGahay +2 more | 2019-12-10 |
| 10458909 | MEMS optical sensor | Daniel Piper, Jang Sim, Yongchun Xin | 2019-10-29 |
| 10415721 | Micro electrical mechanical system (MEMS) valve | Yongchun Xin, Daniel Piper, Jang Sim | 2019-09-17 |
| 10408691 | Fracture ring sensor | Jonathan D. Bradbury, Michael R. Kane | 2019-09-10 |
| 10217682 | Time temperature monitoring system | Taryn J. Davis, Terence L. Kane, Christopher F. Klabes, Andrew J. Martin, Vincent J. McGahay +2 more | 2019-02-26 |
| 10180338 | Optical deformation detection sensor and system | Jonathan D. Bradbury, Michael R. Kane | 2019-01-15 |
| 10180337 | Optical deformation detection sensor and system having a material disposed on the inner surface of an elongated hollow housing | Jonathan D. Bradbury, Michael R. Kane | 2019-01-15 |
| 10134649 | Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoring | Taryn J. Davis, Tuhin Sinha | 2018-11-20 |
| 10068812 | Method and structure for flip-chip package reliability monitoring using capacitive sensors groups | Taryn J. Davis, Tuhin Sinha | 2018-09-04 |
| 10060974 | Electrical circuit odometer sensor array | Christopher F. Klabes, Andrew J. Martin, Vincent J. McGahay, Kathryn E. Schlichting, Melissa A. Smith | 2018-08-28 |
| 10032683 | Time temperature monitoring system | Taryn J. Davis, Terence L. Kane, Christopher F. Klabes, Andrew J. Martin, Vincent J. McGahay +2 more | 2018-07-24 |
| 10008427 | Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoring | Taryn J. Davis, Tuhin Sinha | 2018-06-26 |
| 9818655 | Method and structure for flip-chip package reliability monitoring using capacitive sensors groups | Taryn J. Davis, Tuhin Sinha | 2017-11-14 |