Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5490040 | Surface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arranged outside the circular array | Gene J. Gaudenzi, Joseph M. Mosley, Vito J. Tuozzolo | 1996-02-06 |
| 5147084 | Interconnection structure and test method | John R. Behun, Anson J. Call, Francis F. Cappo, Marie Cole, Karl G. Hoebener +1 more | 1992-09-15 |
| 5060844 | Interconnection structure and test method | John R. Behun, Anson J. Call, Francis F. Cappo, Marie Cole, Karl G. Hoebener +1 more | 1991-10-29 |