Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5490040 | Surface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arranged outside the circular array | Gene J. Gaudenzi, Joseph M. Mosley, John C. Milliken | 1996-02-06 |
| 5032897 | Integrated thermoelectric cooling | Mohanlal S. Mansuria, Joseph M. Mosley, Richard D. Musa, William F. Shutler | 1991-07-16 |
| 5012325 | Thermoelectric cooling via electrical connections | Mohanlal S. Mansuria, Joseph M. Mosley, Richard D. Musa | 1991-04-30 |