Issued Patents All Time
Showing 51–54 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6564449 | Method of making wire connection in semiconductor device | Yu-Fang Tsai, Min-Lung Huang | 2003-05-20 |
| 6365966 | Stacked chip scale package | Sung-Fei Wang | 2002-04-02 |
| 6359340 | Multichip module having a stacked chip arrangement | Chun-Hung Lin, Kuang-Hui Chen, Shyh-Wei Wang, Su Tao | 2002-03-19 |
| 6204559 | Ball grid assembly type semiconductor package having improved chip edge support to prevent chip cracking | Chun-Hung Lin, Yire-Zine Lee, Su Tao | 2001-03-20 |