Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12317757 | System and method for superconducting multi-chip module | Daniel Yohannes, Denis Amparo, Oleksandr Chernyashevskyy, Oleg A. Mukhanov, Mario Renzullo +3 more | 2025-05-27 |
| 11991935 | Materials and methods for fabricating superconducting quantum integrated circuits | Daniel Yohannes, Mario Renzullo, Alexander F. Kirichenko | 2024-05-21 |
| 11711985 | System and method for superconducting multi-chip module | Daniel Yohannes, Denis Amparo, Oleksandr Chernyashevskyy, Oleg A. Mukhanov, Mario Renzullo +3 more | 2023-07-25 |
| 11508896 | Materials and methods for fabricating superconducting quantum integrated circuits | Daniel Yohannes, Mario Renzullo, Alexander F. Kirichenko | 2022-11-22 |
| 11121302 | System and method for superconducting multi-chip module | Daniel Yohannes, Denis Amparo, Oleksandr Chernyashevskyy, Oleg A. Mukhanov, Mario Renzullo +3 more | 2021-09-14 |
| 10833243 | System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits | Sergey K. Tolpygo, Denis Amparo, Richard Hunt, Daniel Yohannes | 2020-11-10 |
| 10283694 | Method for increasing the integration level of superconducting electronics circuits, and a resulting circuit | Daniel Yohannes, Alexander F. Kirichenko, Richard Hunt | 2019-05-07 |
| 9741918 | Method for increasing the integration level of superconducting electronics circuits, and a resulting circuit | Daniel Yohannes, Alexander F. Kirichenko, Richard Hunt | 2017-08-22 |
| 9741920 | System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits | Sergey K. Tolpygo, Denis Amparo, Richard Hunt, Daniel Yohannes | 2017-08-22 |
| 9130116 | System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits | Sergey K. Tolpygo, Denis Amparo, Richard Hunt, Daniel Yohannes | 2015-09-08 |
| 8437818 | System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits | Sergey K. Tolpygo, Denis Amparo, Richard Hunt, Daniel Yohannes | 2013-05-07 |
| 8301214 | System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits | Sergey K. Tolpygo, Denis Amparo, Richard Hunt, Daniel Yohannes | 2012-10-30 |