Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833243 | System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits | Sergey K. Tolpygo, Denis Amparo, John Vivalda, Daniel Yohannes | 2020-11-10 |
| 10283694 | Method for increasing the integration level of superconducting electronics circuits, and a resulting circuit | Daniel Yohannes, Alexander F. Kirichenko, John Vivalda | 2019-05-07 |
| 9741918 | Method for increasing the integration level of superconducting electronics circuits, and a resulting circuit | Daniel Yohannes, Alexander F. Kirichenko, John Vivalda | 2017-08-22 |
| 9741920 | System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits | Sergey K. Tolpygo, Denis Amparo, John Vivalda, Daniel Yohannes | 2017-08-22 |
| 9130116 | System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits | Sergey K. Tolpygo, Denis Amparo, John Vivalda, Daniel Yohannes | 2015-09-08 |
| 8437818 | System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits | Sergey K. Tolpygo, Denis Amparo, John Vivalda, Daniel Yohannes | 2013-05-07 |
| 8301214 | System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits | Sergey K. Tolpygo, Denis Amparo, John Vivalda, Daniel Yohannes | 2012-10-30 |
| 4983798 | Warming devices and method using a material with a solid-solid phase change | Paul E. Eckler | 1991-01-08 |