Denis Amparo — 10 Patents at Hypres

Denis Amparo has been granted 10 US patents while listed as an inventor at Hypres. The first was granted in 2012 and the most recent in May 2025. Denis Amparo ranks #481,000 of 4,157,543 US inventors in our database (top 11.6%). Patent records list Denis Amparo in Marikina, NY, PH.

Issued Patents All Time

Showing 1–10 of 10 patents

Patent #	Title	Co-Inventors	Date
12317757	System and method for superconducting multi-chip module	Daniel Yohannes, Oleksandr Chernyashevskyy, Oleg A. Mukhanov, Mario Renzullo, Andrei Talalaeskii +3 more	2025-05-27
11711985	System and method for superconducting multi-chip module	Daniel Yohannes, Oleksandr Chernyashevskyy, Oleg A. Mukhanov, Mario Renzullo, Andrei Talalaevskii +3 more	2023-07-25
11121302	System and method for superconducting multi-chip module	Daniel Yohannes, Oleksandr Chernyashevskyy, Oleg A. Mukhanov, Mario Renzullo, Andrei Talalaeskii +3 more	2021-09-14
10833243	System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits	Sergey K. Tolpygo, Richard Hunt, John Vivalda, Daniel Yohannes	2020-11-10
10505097	System and method for array diagnostics in superconducting integrated circuit	Amol Inamdar, Jie Ren	2019-12-10
10222416	System and method for array diagnostics in superconducting integrated circuit	Amol Inamdar, Jie Ren	2019-03-05
9741920	System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits	Sergey K. Tolpygo, Richard Hunt, John Vivalda, Daniel Yohannes	2017-08-22
9130116	System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits	Sergey K. Tolpygo, Richard Hunt, John Vivalda, Daniel Yohannes	2015-09-08
8437818	System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits	Sergey K. Tolpygo, Richard Hunt, John Vivalda, Daniel Yohannes	2013-05-07
8301214	System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits	Sergey K. Tolpygo, Richard Hunt, John Vivalda, Daniel Yohannes	2012-10-30

Denis Amparo — 10 Patents

Issued Patents All Time

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