DA

Denis Amparo

HY Hypres: 6 patents #10 of 52Top 20%
SE Seeqc: 3 patents #13 of 31Top 45%
Overall (All Time): #482,701 of 4,157,543Top 15%
10
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12317757 System and method for superconducting multi-chip module Daniel Yohannes, Oleksandr Chernyashevskyy, Oleg A. Mukhanov, Mario Renzullo, Andrei Talalaeskii +3 more 2025-05-27
11711985 System and method for superconducting multi-chip module Daniel Yohannes, Oleksandr Chernyashevskyy, Oleg A. Mukhanov, Mario Renzullo, Andrei Talalaevskii +3 more 2023-07-25
11121302 System and method for superconducting multi-chip module Daniel Yohannes, Oleksandr Chernyashevskyy, Oleg A. Mukhanov, Mario Renzullo, Andrei Talalaeskii +3 more 2021-09-14
10833243 System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits Sergey K. Tolpygo, Richard Hunt, John Vivalda, Daniel Yohannes 2020-11-10
10505097 System and method for array diagnostics in superconducting integrated circuit Amol Inamdar, Jie Ren 2019-12-10
10222416 System and method for array diagnostics in superconducting integrated circuit Amol Inamdar, Jie Ren 2019-03-05
9741920 System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits Sergey K. Tolpygo, Richard Hunt, John Vivalda, Daniel Yohannes 2017-08-22
9130116 System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits Sergey K. Tolpygo, Richard Hunt, John Vivalda, Daniel Yohannes 2015-09-08
8437818 System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits Sergey K. Tolpygo, Richard Hunt, John Vivalda, Daniel Yohannes 2013-05-07
8301214 System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits Sergey K. Tolpygo, Richard Hunt, John Vivalda, Daniel Yohannes 2012-10-30