Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12317467 | Semiconductor device comprising work function metal pattern in boundary region and method for fabricating the same | Dong Oh Kim, Seok Han Park, Chan Yoon, Ki Seok Lee, Ho-In Lee +3 more | 2025-05-27 |
| 12080619 | Semiconductor package | Sang-Uk Kim | 2024-09-03 |
| 11387165 | Multi-layer cooling structure including through-silicon vias through a plurality of directly-bonded substrates and methods of making the same | Feng Zhou, Ercan Mehmet Dede | 2022-07-12 |
| 10998324 | Semiconductor device comprising work function metal pattern in boundary region and method for fabricating the same | Dong Oh Kim, Seok Han Park, Chan Yoon, Ki Seok Lee, Ho-In Lee +3 more | 2021-05-04 |
| 10784115 | Method of etching microelectronic mechanical system features in a silicon wafer | Feng Zhou, Ercan Mehmet Dede, Mehdi Asheghi, Kenneth E. Goodson | 2020-09-22 |
| 10685905 | Multi-layer cooling structure including through-silicon vias through a plurality of directly-bonded substrates and methods of making the same | Feng Zhou, Ercan Mehmet Dede | 2020-06-16 |
| 10679997 | Semiconductor device comprising work function metal pattern in boundary region and method for fabricating the same | Dong Oh Kim, Seok Han Park, Chan Yoon, Ki Seok Lee, Ho-In Lee +3 more | 2020-06-09 |
| 10395940 | Method of etching microelectronic mechanical system features in a silicon wafer | Feng Zhou, Ercan Mehmet Dede, Mehdi Asheghi, Kenneth E. Goodson | 2019-08-27 |
| 10332894 | Semiconductor device comprising work function metal pattern in boundry region and method for fabricating the same | Dong Oh Kim, Seok Han Park, Chan Yoon, Ki Seok Lee, Ho-In Lee +3 more | 2019-06-25 |
| 10325802 | Method for fabricating semiconductor device | Ho-In Lee, Dong Oh Kim, Seok Han Park, Chan Yoon, Jinwoo Hong +3 more | 2019-06-18 |
| 9015957 | Clothes dryer | Myoung Jong Kim | 2015-04-28 |
| 8479410 | Dryer and a control method thereof | Jun Seok Lee | 2013-07-09 |