Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9640680 | Wide-band transparent electrical contacts and interconnects for FPAS and a method of making the same | Kyung-Ah Son, Hasan Sharifi, Jeong-Sun Moon, Hwa Chang Seo | 2017-05-02 |
| 9190534 | Enhancement mode normally-off gallium nitride heterostructure field effect transistor | Tahir Hussain, Miroslav Micovic, Shawn D. Burnham | 2015-11-17 |
| 8728884 | Enhancement mode normally-off gallium nitride heterostructure field effect transistor | Tahir Hussain, Miroslav Micovic, Shawn D. Burnham | 2014-05-20 |
| 8368119 | Integrated structure with transistors and schottky diodes and process for fabricating the same | Louis Luh, Keh-Chung Wang, Miroslav Micovic, David H. Chow, Don Hitko | 2013-02-05 |
| 7989277 | Integrated structure with transistors and Schottky diodes and process for fabricating the same | Louis Luh, Keh-Chung Wang, Miroslav Micovic, David H. Chow, Don Hitko | 2011-08-02 |
| 7514759 | Piezoelectric MEMS integration with GaN technology | Sarabjit Mehta, David Grider | 2009-04-07 |
| 7247893 | Non-planar nitride-based heterostructure field effect transistor | Jeong-Sun Moon, Paul Hashimoto, David Grider | 2007-07-24 |
| 6830945 | Method for fabricating a non-planar nitride-based heterostructure field effect transistor | Jeong-Sun Moon, Paul Hashimoto, David Grider | 2004-12-14 |
| 5998817 | High power prematched MMIC transistor with improved ground potential continuity | Cheng P. Wen, Peter Chu, Michael R. Cole, Robert F. Wang, Liping D. Hou | 1999-12-07 |
| 5877560 | Flip chip microwave module and fabrication method | Cheng P. Wen, Kuo-Hsin Li | 1999-03-02 |
| 5861341 | Plated nickel-gold/dielectric interface for passivated MMICs | Cheng P. Wen, Arlene E. Arthur | 1999-01-19 |
| 5773897 | Flip chip monolithic microwave integrated circuit with mushroom-shaped, solder-capped, plated metal bumps | Cheng P. Wen | 1998-06-30 |
| 5708283 | Flip chip high power monolithic integrated circuit thermal bumps | Cheng P. Wen, William D. Gray | 1998-01-13 |
| 5616517 | Flip chip high power monolithic integrated circuit thermal bumps and fabrication method | Cheng P. Wen, William D. Gray | 1997-04-01 |
| 5514838 | Circuit structure with non-migrating silver contacts | Cheng P. Wen, Min-Wen Chiang | 1996-05-07 |
| 5502002 | Polyimide passivation of GaAs microwave monolithic integrated circuit flip-chip | William D. Gray | 1996-03-26 |
| 5406122 | Microelectronic circuit structure including conductor bridges encapsulated in inorganic dielectric passivation layer | William D. Gray, Cheng P. Wen | 1995-04-11 |
| 4855796 | Beam lead mixer diode | Cheng P. Wen, Jen K. Kung | 1989-08-08 |
| 4800420 | Two-terminal semiconductor diode arrangement | James Chen, Cheng-Keng Pao | 1989-01-24 |