Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5708283 | Flip chip high power monolithic integrated circuit thermal bumps | Cheng P. Wen, Wah S. Wong | 1998-01-13 |
| 5616517 | Flip chip high power monolithic integrated circuit thermal bumps and fabrication method | Cheng P. Wen, Wah S. Wong | 1997-04-01 |
| 5502002 | Polyimide passivation of GaAs microwave monolithic integrated circuit flip-chip | Wah S. Wong | 1996-03-26 |
| 5406122 | Microelectronic circuit structure including conductor bridges encapsulated in inorganic dielectric passivation layer | Wah S. Wong, Cheng P. Wen | 1995-04-11 |