Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6770547 | Method for producing a semiconductor device | Kosuke Inoue, Hiroyuki Tenmei, Noriyuki Oroku, Hiroshi Hozoji, Shigeharu Tsunoda +6 more | 2004-08-03 |
| 6756688 | Wiring board and its production method, semiconductor device and its production method, and electronic apparatus | Yasumori Narizuka, Mitsuko Itou, Hiroyuki Tenmei | 2004-06-29 |
| 6720591 | Semiconductor integrated circuit device | Toshio Miyamoto, Ichiro Anjo, Asao Nishimura | 2004-04-13 |
| 6695200 | Method of producing electronic part with bumps and method of producing electronic part | Takamichi Suzuki, Noriyuki Oroku, Kosuke Inoue | 2004-02-24 |
| 6624504 | Semiconductor device and method for manufacturing the same | Kosuke Inoue, Hiroyuki Tenmei, Noriyuki Oroku, Hiroshi Hozoji, Shigeharu Tsunoda +6 more | 2003-09-23 |
| 6610934 | Semiconductor module and method of making the device | Takao Terabayashi, Hiroyuki Tenmei, Hiroshi Hozoji, Naoya Kanda | 2003-08-26 |
| 6595404 | Method of producing electronic part with bumps and method of producing electronic part | Takamichi Suzuki, Noriyuki Oroku, Kosuke Inoue | 2003-07-22 |
| 6515372 | Wiring board and its production method, semiconductor device and its production method, and electronic apparatus | Yasumori Narizuka, Mitsuko Itou, Hiroyuki Tenmei | 2003-02-04 |
| 5480048 | Multilayer wiring board fabricating method | Naoya Kitamura, Hisashi Sugiyama, Masayuki Kyoui, Hideyasu Murooka, Ryoji Iwamura +1 more | 1996-01-02 |