Issued Patents All Time
Showing 26–38 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7279424 | Method for fabricating thin film magnetic heads using CMP with polishing stop layer | Ming Jiang, Hong Bing Zhang | 2007-10-09 |
| 7264535 | Run-to-run control of backside pressure for CMP radial uniformity optimization based on center-to-edge model | Ming Jiang, Yeak-Chong Wong | 2007-09-04 |
| 7220167 | Gentle chemical mechanical polishing (CMP) liftoff process | Jian-Huei Feng, Ming Jiang, John Jaekoyun Yang | 2007-05-22 |
| 7217666 | Reactive ion milling/RIE assisted CMP | Ming Jiang, Jerry Lo, Aron Pentek, Yi Zheng | 2007-05-15 |
| 7215511 | Magnetic write head with gap termination less than half distance between pedestal and back gap | Edward Hin Pong Lee, Aron Pentek | 2007-05-08 |
| 7144518 | CMP for corrosion-free CoFe elements for magnetic heads | Christopher W. Bergevin, Tom Harris, Ming Jiang, John Jaekoyun Yang | 2006-12-05 |
| 7108588 | System, method, and apparatus for wetting slurry delivery tubes in a chemical mechanical polishing process to prevent clogging thereof | James Nystrom | 2006-09-19 |
| 7081041 | Manufacturing method for forming a write head top pole using chemical mechanical polishing with a DLC stop layer | Ming Jiang | 2006-07-25 |
| 7075094 | System, method, and apparatus for ion beam etching process stability using a reference for time scaling subsequent steps | Michael Feldbaum, Wipul Pemsiri Jayasekara, Aron Pentek | 2006-07-11 |
| 7029376 | Process of fabricating write pole in magnetic recording head using rhodium CMP stop layer | Ming Jiang, Jyh-Shuey Lo, Hong Bing Zhang | 2006-04-18 |
| 6984613 | Post chemical mechanical polishing cleaning solution for 2.45T CoFeNi structures of thin film magnetic heads | Ming Jiang, Nick Lara | 2006-01-10 |
| 6835117 | Endpoint detection in chemical-mechanical polishing of patterned wafers having a low pattern density | Xinhui Wang, Leping Li, Yingru Gu | 2004-12-28 |
| 6131271 | Method of planarizing first pole piece layer of write head by lapping without delamination of first pole piece layer from wafer substrate | Robert E. Fontana, Jr., William L. Guthrie, Eric James Lee, Li-Chung Lee, Francisco Martin | 2000-10-17 |