Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11320430 | Magnetic particle dispersion | Hirokazu KAI, Yuuichi Ueya | 2022-05-03 |
| 8028402 | Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof | Hidehiro Nakamura, Akishi Nakaso, Shigeharu Arike, Fumio Inoue, Tetsuya Enomoto +1 more | 2011-10-04 |