Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7716823 | Bonding an interconnect to a circuit device and related devices | Neal Meyer, Ronald A. Hellekson | 2010-05-18 |
| 7262498 | Assembly with a ring and bonding pads formed of a same material on a substrate | David Craig, Chien-Hua Chen, Charles C. Haluzak | 2007-08-28 |
| 6837572 | Droplet plate architecture | Ravi Ramaswami, Victor Joseph, Colin C. Davis, Daniel A. Kearl, Martha A. Truninger +2 more | 2005-01-04 |
| 6834942 | Fluid ejector head having a planar passivation layer | Kenneth E. Trueba, Ronald A. Hellekson | 2004-12-28 |
| 6767474 | Fluid ejector head having a planar passivation layer | Kenneth E. Trueba, Ronald A. Hellekson | 2004-07-27 |
| 6716737 | Method of forming a through-substrate interconnect | Hubert Vander Plas, Barry C. Snyder, Ronald A. Hellekson, Diane Lai, Samson Berhane | 2004-04-06 |
| 6682874 | Droplet plate architecture | Ravi Ramaswami, Victor Joseph, Colin C. Davis, Daniel A. Kearl, Martha A. Truninger +2 more | 2004-01-27 |
| 6482574 | Droplet plate architecture in ink-jet printheads | Ravi Ramaswami, Victor Joseph, Colin C. Davis, Daniel A. Kearl, Martha A. Truninger +2 more | 2002-11-19 |