Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7432582 | Method of forming a through-substrate interconnect | Samson Berhane, Barry C. Snyder, Ronald A. Hellekson, Hubert Vander Plas | 2008-10-07 |
| 6902872 | Method of forming a through-substrate interconnect | Samson Berhane, Barry C. Snyder, Ronald A. Hellekson, Hubert Vander Plas | 2005-06-07 |
| 6764605 | Particle tolerant architecture for feed holes and method of manufacturing | Jeremy Donaldson, Naoto Kawamura, Daniel A. Kearl, Donald J. Milligan, J. Daniel Smith +5 more | 2004-07-20 |
| 6716737 | Method of forming a through-substrate interconnect | Hubert Vander Plas, Barry C. Snyder, Ronald A. Hellekson, Ronnie Yenchik, Samson Berhane | 2004-04-06 |
| 6555480 | Substrate with fluidic channel and method of manufacturing | Donald J. Milligan, Tim R. Koch, Martha A. Truninger, Timothy Emery, J. Daniel Smith | 2003-04-29 |