Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7432582 | Method of forming a through-substrate interconnect | Diane Lai, Samson Berhane, Barry C. Snyder, Ronald A. Hellekson | 2008-10-07 |
| 6902872 | Method of forming a through-substrate interconnect | Diane Lai, Samson Berhane, Barry C. Snyder, Ronald A. Hellekson | 2005-06-07 |
| 6716737 | Method of forming a through-substrate interconnect | Barry C. Snyder, Ronald A. Hellekson, Ronnie Yenchik, Diane Lai, Samson Berhane | 2004-04-06 |