Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8174094 | Bonded structures formed by plasma enhanced bonding | Chien-Hua Chen, Ronald A. Hellekson | 2012-05-08 |
| 7563691 | Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding | Chien-Hua Chen, Ronald A. Hellekson | 2009-07-21 |
| 7432582 | Method of forming a through-substrate interconnect | Diane Lai, Samson Berhane, Ronald A. Hellekson, Hubert Vander Plas | 2008-10-07 |
| 6902872 | Method of forming a through-substrate interconnect | Diane Lai, Samson Berhane, Ronald A. Hellekson, Hubert Vander Plas | 2005-06-07 |
| 6716737 | Method of forming a through-substrate interconnect | Hubert Vander Plas, Ronald A. Hellekson, Ronnie Yenchik, Diane Lai, Samson Berhane | 2004-04-06 |
| 6659592 | Multiple redundant through hole electrical interconnects and method for forming the same | Hubert A. Vander Plas, Ron Allen Hellekson, Alfred I-Tsung Pan | 2003-12-09 |