Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053587 | Reworkable thermosetting resin composition | Philip T. Klemarczyk, Afranio Torres-Filho, Erin K. Yeager, Takahisa Doba | 2011-11-08 |
| 7709559 | Cure accelerators for anaerobic curable compositions | — | 2010-05-04 |
| 7705064 | Photosensitive compounds, photopolymerizable compositions including the same, and methods of making and using the same | Anthony F. Jacobine, John G. Woods, Joel D. Schall, Steven T. Nakos, David M. Glaser | 2010-04-27 |
| 7671114 | Adhesive of substituted oxirane or oxetane compound with silver-based, lead-free solder | John G. Woods, Yuhshi Lu, Bruce C. B. Chan, Philip T. Klemarczyk | 2010-03-02 |
| 7411009 | Cure accelerators for anaerobic curable compositions | Philip T. Klemarczyk, Karen R. Brantl | 2008-08-12 |
| 7411025 | Cure accelerators for anaerobic curable compositions | Philip T. Klemarczyk, Karen R. Brantl | 2008-08-12 |
| 7012120 | Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent | Philp T. Klemarczyk, Afranio Torres-Filho, Erin K. Yaeger, Takahisa Doba | 2006-03-14 |
| 7009009 | Fluxing underfill compositions | Lawrence N. Crane, Mark M. Konarski, J. Paul Krug, John G. Woods | 2006-03-07 |
| 6958368 | Cure accelerators for anaerobic curable compositions | Philp T. Klemarczyk, Karen R. Brantl | 2005-10-25 |
| 6667194 | Method of bonding die chip with underfill fluxing composition | Lawrence N. Crane, Mark M. Konarski, J. Paul Krug, John G. Woods | 2003-12-23 |
| 6572980 | Reworkable thermosetting resin compositions | Philip T. Klemarczyk | 2003-06-03 |