Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12234390 | Debondable compositions | Shengqian Kong, Wenhua Zhang, Stephen Hynes, John G. Woods, Jiangbo Ouyang +2 more | 2025-02-25 |
| 10392543 | Reactive resins and formulations for low refractive index and low dielectric constant applications | Bahram Issari, Wenhua Zhang, John G. Woods, Shengqian Kong, Jiangbo Ouyang +1 more | 2019-08-27 |
| 10280349 | 1K UV and thermal cure high temperature debondable adhesive | Stephen Hynes, Chunyu Sun, Jiangbo Ouyang, John G. Woods, Bahram Issari +2 more | 2019-05-07 |
| 8921464 | Adhesive compositions and use thereof | Charles W. Paul, Allison Yue Xiao, Andrea Eodice | 2014-12-30 |
| 8426986 | Phase separated curable compositions | Allison Yue Xiao | 2013-04-23 |
| 7070822 | Powdered adhesive for foods | Yong-Cheng Shi, Robert L. Billmers, Russell Stoop, David Huang | 2006-07-04 |