Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12234390 | Debondable compositions | Shengqian Kong, Yayun Liu, Wenhua Zhang, Stephen Hynes, John G. Woods +2 more | 2025-02-25 |
| 10280349 | 1K UV and thermal cure high temperature debondable adhesive | Stephen Hynes, Jiangbo Ouyang, John G. Woods, Bahram Issari, Shengqian Kong +2 more | 2019-05-07 |
| 9850409 | High temperature debondable adhesive | Wenhua Zhang, Xiaoyan Huang, Shengqian Kong, Xiao Allison Yue, Stephen Hynes +1 more | 2017-12-26 |